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As the experts in oven performance analysis,KIC offers a solution:Smart Reflow Analyzer(SRA)
软硬结合是焊接炉智能化的必然趋势
软硬结合是未来焊接炉的发展方向
     
Thermocouple Preparation
In Line Package (SOIC)
TC Wire Management
     
A Profile for Every Board
Measure the wave solder process
Reflow Oven Loading
     
Improve Batch X Ray Selection
The Profiling Machine
Reflow Yield Report
     
Measuring changes in the reflow oven
MVP – Manual Virtual Profiling
Adjust A Profile To Get In Spec For Reflow
     
Hourly SPC Warnings Alarms Reflow Oven
KIC 24-7 Product Traceability For Reflow
KIC 24-7 Monitor Window Into Thermal Process
     
Reflow Oven Electricity Reduction
Reflow Oven In Spec
Reflow Oven Working Too Hard Wasting Electricity
     
Thermal Profiling: How to Inspect your Reflow Process
Searching for the Best Oven Recipe
KIC RPI Reflow Process Inspection AOI
     
Wave Solder — Automated Profiling
KIC SMT Reflow Process Report
KIC X⁵ – The World’s Most Advanced Thermal Profiler
     
Automatic Profiling Explained
K²+ Mobile Profile Viewer
Automatic AOI and X Ray
     
Automatic Profiling for Reflow
Complement AOI and AXI with Automatic System
Manual vs Auto Profiling AUTO ONLY
     
Manual vs Auto Profiling MANUAL ONLY
Auto-Focus Power solves that oven setup puzzle
Lead Free Thermal Process Window Intersection Component Solder Paste Substrate Tolerances
     
Oven setup for PCB components with different thermal specs
Thermocouple Preparation
BGA Thermocouple Attachement